efeseasml

曲线图1002表示晶片平台根据ASML的EFESE技术而倾斜的情况的模拟，其是增加焦点深度以促进在晶片上的三维特征(诸如通孔和孔)的打印的过程。在EFESE技术中，将晶片平台 ...,IntheEFESEtechnique,thewaferstageistiltedatanangletoscantheaerialimagethroughthefocuswhileexposingthewafer.TheEFESEtechniquegenerally ...,標繪圖1002表示晶圓載物台根據ASML之EFESE技術傾斜的情境之模擬，其是用於增加聚焦深度以便於在晶圓上打印...

參考資訊如下
在单次光刻曝光通过过程中形成多个空间图像

曲线图1002表示晶片平台根据ASML的EFESE技术而倾斜的情况的模拟，其是增加焦点深度以促进在晶片上的三维特征(诸如通孔和孔)的打印的过程。在EFESE技术中，将晶片平台 ...

Forming multiple aerial images in a single lithography ...

In the EFESE technique, the wafer stage is tilted at an angle to scan the aerial image through the focus while exposing the wafer. The EFESE technique generally ...

TWI738460B

標繪圖1002表示晶圓載物台根據ASML之EFESE技術傾斜的情境之模擬，其是用於增加聚焦深度以便於在晶圓上打印三維特徵(諸如通孔及空穴)的程序。在EFESE技術中，晶圓載物台 ...

Multi

2020年3月25日 — ASML introduced EFESE Rx, a method of tilting the stage during exposure to create multiple focus positions and finally Lalovic4 introduced a ...

ASML

ASML是全世界唯一採用極紫外光的微影設備製造商。為了能控制EUV極紫外光光源，並推動EUV微影系統商用化，20多年來，ASML持續投入研發，克服各種艱難 ...

Laser Produced Plasma Light Source for EUVL

It is now complete and has been adopted by ASML as the standard interface for. EUV Scanners. 6. SUMMARY. Laser-produced plasma has been shown to be the leading ...

Focus Drilling for Increased Process Latitude in High

2018年10月8日 — ... ASML, De Run. 6501, 5504 DR Veldhoven, The Netherlands. Cymer B.V.,. De ... sure. EFESE-HR vs. EFESE. DOF vs. FR comparison @ 8% EL. 0. 0.05. 0.1.

Multi

由 W Conley 著作 · 2020 — ASML introduced EFESE Rx, a method of tilting the stage during exposure to create multiple focus positions and finally Lalovic4 introduced a ...